BM303A Automatic Epoxy Die Bonder is a highly stable and precise equipment which can serve as a fast and efficient die bonding solution for integrated circuits (including the consumer electronics and automotive electronics).
Wafer size
6-12 inches
Die size
0.2*0.2mm-15*15mm
High-end and cost-effective substitute
Fill the gap of high-end die bonder in the domestic market and meet the requirement of end users for high production efficiency and great product consistency
High output
UPH up to 20K
Strong compatibility
suitable for 12 inch and smaller wafer and multiple frames
Outstanding reliability
equipped with Poka-yoke function before loading, inline measurement and auto compensation of dispensed volume, inline inspection and correction of die position after bonding
Great convenience
adjust the workholder automatically to fit the size of leadframe and make auto wafer feed possible
+86-0510-81816658
sales@wxautowell.com
No.3 Xinhua Road,
